Micro Optics

	Scientific

Micro Optics, Optical Coatings

Coatings are produced for wavelengths from 180 nm to 2.5 microns and include antireflective, metallic and multi-layer dielectric reflectors. We can solve your problems with innovative solutions and unprecedented attention to your specific applications. We specialize in Ion Beam PVD coating processes, which provide robust coatings that withstand Mil-Spec environments. We have an extensive library of coating designs in production, including anti-reflection, high reflectors, beam splitters and broadband metallic coatings.

Product Range:

HIGH REFLECTIVE MIRRORS:

Dimensions from 200 microns
Reflectivity greater than 99.5%
Wavelengths from 200nm to 2.5 micron

PRISMS:

Dimensions 2mm
Angles: 30, 45, 90 degrees
Antireflective coating on faces, Reflective hypotenuse

WINDOWS, Lenses, Polarizers, Waveplates:

Dimensions from 200 microns
Transmission greater than 99.5%
Wavelengths from 200 nm to 2.5 microns

ETALONS:

Analytical and Telecommunication
Telco Free Spectral Range: 50Ghz (.4nm), 100Ghz (.8nm), 200Ghz (1.6nm)
Finesse: 3 to 20
Insertion Loss: .5db

MULTI FUNCTION COMPONENTS:

Combination mirrors, windows, beamsplitters
Feature size from 100 microns
Substrates, Fused Silica, BK-7, Silicon, and Specialty Glass

PATTERNED BEAM SPLITTERS:

Feature size to 100 microns
Coatings multilayer dielectric and metallic
Materials: Fused Silica, BK-7, Silicon, Specialty Glass

PVD Coater

We provide expert service for coating customer-supplied or our own substrates including optical fibers, glass, ceramic or metal surfaces. We also provide polishing and dicing service to custom specifications.

COATINGS:

Metallic Reflectors: Aluminum, Silver, Gold
High Reflector: Multi-layer Hard Dielectrics
Antireflective: Single Layer and Multi-layer Hard Dielectrics
Beamsplitters: R/T Ratio Splitters, Dichroic

DICING:

Die size to 2.00mm
Materials: Glass, Fused Silica, Silicon, Specialty Glass

FIBER POLISHING:

Flat, Angled, and Radius FP-spec

We are very customer focused. We listen to our customers and work with them to produce a component that will meet their expectations 100%. The application notes provided below have been compiled based on frequently asked questions (FAQ) from our customers. If you have a question, please give us a call, we would be happy to discuss it.

APPLICATION NOTES (Considerations in Specifying Micro Optics):

Material:

The selection of material is dependent on the application. The most common substrate material, hence best price/performance trade-off is listed below with important design specifications:

	Transmission Range	Index of Refraction	Thermal Coefficient
Fused Silica	185-2200nm	1.45847 (546.1nm)	0.57 ppm/K (0-200°C)
Bk-7	340-2100nm	1.51680 (546.1nm)	8.3x10-6/°C (20-300°C)
Silicon	1200-7000nm	3.4289 (4 micron)	2.55x10-6/°C (25°C)
Silicon	210-3500nm	1.7708 (546.1nm)	7.7x10-6/°C (0-500°C)

Other materials such as ceramic or specialty glass are considerations based on thermal properties and index of refraction requirements.

Fabrication:

The fabrication process of taking raw material and shaping and polishing it to the final substrate requires multiple steps. The traditional process of grinding and polishing is cost effective. However, due to the nature of micro optics, development is required to control tolerances on a micro scale. The development cost in this case is usually associated with engineering of the tooling.

Coatings:

For optical components applying the coating is a batch process. The cost associated with a given part is the average of the entire coating run. With the exception of metal and single layer antireflective coatings, the process will require a test run to maintain adequate process control. This assures that when the coating run is performed it will meet the design specifications. After repeated coating runs of the same design without interruptions, tolerances can be tightened.

Dicing:

The final step of dicing can be performed using two methods of blocking. The least expensive is by using tape to hold the substrate in place. This method works well when the thickness of the final part is less than 1/5 of the overall surface area. If the thickness is greater than this value, then the best method is to wax the substrate to a glass carrier. The tradeoff in using the tape method on thicker parts is that chipping will increase and detachment of parts during dicing is likely.

Packaging:

Clean room grade packaging which can hold the parts in a stationary location is ideal. Gel and membrane packages work best. Avoid packaging where the parts are in constant motion such as envelopes, tubes and bags, as this may lead to chipping.